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Abstract: .. Cross Reference. 1 TelCom Semiconductor, Inc.. Gen. Information. COMPANY PROFILE .. System Management TC32M 3-Pin Processor Supervisor with Watchdog Timer .. |
4973.8 Kb |
115 pg. |
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Abstract: .. Applications Documents Device Cross Reference. This quick-reference list indicates where .. the DSP56300/DSP56600 Digital Signal Processors APR22/D Application Conversion from the .. |
810.14 Kb |
132 pg. |
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Abstract: .. The Low-Power Embedded Pentium® Processor with MMXTM Technology may contain design defects .. 2 Pin Cross Reference by Pin Name (PPGA Package .. |
701.11 Kb |
62 pg. |
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Abstract: .. The Low-Power Embedded Pentium® Processor with MMXTM Technology may contain design defects .. 2 Pin Cross Reference by Pin Name (PPGA Package .. |
701.11 Kb |
62 pg. |
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Abstract: .. Device & Package Cross Reference. Tables 2 through 18 show the devices available in Ball-Grid .. Thermal Resistance of Excalibur Embedded Processor Solutions. Device. Pin Count. Package θJC .. |
2742.7 Kb |
198 pg. |
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Abstract: .. — 208-Lead Shrink Quad Flat Pack (SQFP) ■ 5-Volt Processor, 66 MHz, 33 MHz CLK. — 168-Pin Pin Grid .. Pin Cross Reference for 208-Lead SQFP Package .. |
2742.7 Kb |
198 pg. |
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| 7. |
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Abstract: .. Device & Package Cross Reference. Table 1 through 14 show the devices available in Ball-Grid .. Thermal Resistance of Excalibur Embedded Processor Solutions. Device. Pin Count. Package θJC .. |
1673.74 Kb |
169 pg. |
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Abstract: .. Low-Power Embedded Pentium® Processor with MMXTM Technology. Advance Information Datasheet .. Pin Cross Reference by Pin Name (PPGA Package) (Sheet 1 of 2) Pin Location Pin Location Pin .. |
1673.74 Kb |
169 pg. |
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Abstract: .. The Embedded IntelDX2TM processor may contain design defects or errors known as errata which .. Pin Cross Reference for 208-Lead SQFP Package .. |
457.02 Kb |
48 pg. |
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| 10. |
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Abstract: .. The Embedded IntelDX2TM processor may contain design defects or errors known as errata which .. Pin Cross Reference for 208-Lead SQFP Package .. |
1589.86 Kb |
48 pg. |
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